![]() It originates at ambient temperature and ends at the peak temperature. The ramp rate is the slope of temperature versus time for the heating portion of the reflow profile. Pricing and Availability on millions of electronic components from Digi-Key Electronics. The actual reflow of the solder alloy involves the creation of a mechanical and electrical bond through the formation of ti n-copper intermetallics. max) to ensure even distribution of any separated material. ![]() Mix the product lightly and thoroughly (1-2 mins. SMT Board Assembly Process Recommendations. Allow the solder paste to warm up completely and naturally to ambient temperature (8 hrs.) prior to breaking the seal for use. Also, make sure to measure the temperature of the aluminum, and not the surrounding air. It has been confirmed by passing a PCB with fitted thermocouples through the oven - Research indicated that this can be caused by initial temperature ramp being too steep but adjusting this setting did not make any discernible difference - Humidity was around 60% on the day but we've found similar results earlier this week on days with low humidity I've contacted Chipquick but yet to have a response from them so thought I'd check if the knowledgeable people here have any suggestions what might be happening. NC191LTA10 No-Clean Solder Paste Bi57Sn42Ag1 (57/42/1) Syringe, 0.35 oz (10g), 3cc from Chip Quik Inc. NC258 is best used within 1 year when stored between -22° and +22° C (-8° and 72° F). The solder paste itself needs to reach at least 249C (as per our recommended reflow profile) to fully melt, but you will usually need to heat your aluminum hotter than this. The paste was purchased from Digikey with a date code of this year - The paste was brought to room temperature and well mixed before use - Paste was applied using a stencil but components were placed by hand, so it was a few hours before entering the oven - The reflow profile has been set as per the solder paste datasheet. ![]() We chose Chipquick because it's supposed to have a very long shelf life and is less fussy about storage (even though we keep it refrigerated). ![]() We tried it with our little prototyping batch oven and had the same results. We've been trying out Chipquick TS391AX250 solder paste while commissioning our new conveyor reflow oven (as part of our new SMT line) but we're having lots of issues with tiny solder balls suspended in the flux residue post reflow. ![]()
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